rasanpreetk

Experience

• Senior Product Developmet Engineer Ranovus Inc. · Full-time Aug 2021 – Present 3 yrs 3 mos Ottawa, ON, Canada • Subject Matter expert in thermal and mechanical FEA simulations for opto-electronic devices and components
  • Responsible for product configuration management and maintenance of BOM, including product planning for transfer
  of complex R&D projects through to production
  • Act as a mentor/informal trainer to junior engineers and technicians
  • Design of alignment stations, defining the jigging and tooling requirements for manufacturing of integrated photonics and co-packaged electronics-optics
  • Finite Element modeling and simulation using ANSYS for optimizing the design and process parameters with an aim reduce the testing time and effort
  • Process development and optimization involving epoxy dispense, wire bonding, flip chip, fiber alignment and attach, lens attach, laser alignment and integration etc.
  • Translation of product requirements into mechanical specifications and creating build standards for new products
  • Component and assembly level design including precision optical mounts, kinematic mounting, vacuum design, thermal
  management, tooling design, ruggedization, serviceability, and adherence to MIL-spec.
  • Assure product and process quality by designing testing methods; testing finished goods and process capabilities; establishing standards; confirming manufacturing processes.
  • Prepare & provide training to contract manufacturing production personnel at Ranovus and/or CM.
  • Support for R&D Alpha/Beta builds, lead NPI roll-out, and support mass production post GA
• Opto Mechanical Engineer Allegiant 3D Inc · Self-employed Oct 2020 – Present 4 yrs 1 mos Montreal, QC, Canada • Responsible for package and product risk assessment. mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, cost, and manufacturability
  • Interfaced and efficiently negotiated across engineering teams to balance performance needs, schedule commitment, trade-offs, and constraints to product cost and performance
  • Coordinated with process engineers, and contract manufacturers to ensure manufacturability and process flow
  • Reliability evaluation of optical and laser packages used in Aerospace, Automotive, Defense, Telecom, etc.
  • Performed fiber characterization studies to establish best practices for fiber mounting in microelectronic packages
  • Generated Mechanical-Thermal-Structural FEA models to optimize the performance of optical modules
  • Ruggedized and athermal design of thermal expansion sensitive opto-mechanical and laser packages
  • Generated FEA process model for optical fiber sealing with and without metallization for hermetic packages
  • Designed and developed fiber optic inspection equipment according to the TIA standards
  • Developed designs of components for thermal, shock, structural, form/fit, and function requirements
• Mechanical Engineer ADVA · Full-time May 2019 – Jul 2020 1 yrs 2 mos Ottawa, ON, Canada • Designed, developed, and integrated advanced electronic and optical transceivers, instruments, and components
  • Estimated the costs involved in procurement of raw material, equipment, and contractor pricing to develop various test stations, jigs, and fixtures for ensuring productivity, quality, reliability of final product
  • Performed characterization studies to determine critical areas of improvement in the process development
  • Conducted FEA and CFD on a variety of optical transceivers modules to study the behavior in a virtual environment
  • Designed and developed the alignment and positioning system essential for optical module (IC-TROSA) assembly by using 3D mechanical CAD tools, kept as a Trade Secret
  • Developed numerous Pickup/Drop-off tools using metal machining, die casting, and sheet metal for manipulation of small sized optical and electronic components to be used in production and assembly lines
  • Developed processes and documented the procedures for epoxy/adhesive application and UV curing technique for product packaging by using statistical process control, experimentation, and Lean manufacturing principles